3 outstanding students honored with MSE Junior Awards

Three outstanding students were honored with the 2022 MSE Junior Awards, recognizing academic excellence and community engagement. The awards were announced during Cornell’s Materials Science Expo on April 22.

The awardees are:

Sophia Chen ’23
James L. Gregg Outstanding Junior Award

The James L. Gregg Award was established in memory of Professor James L. Gregg. It is awarded to the “outstanding junior” as determined by the cumulative GPA after the first semester of the junior year as well as involvement in the academic program.

The James L. Gregg Prize of $750 is funded in part by the James L. Gregg Prize fund, which was donated by Mrs. Doris Meigs.

students shaking hands with professor
Chekesha Watson, associate professor and MSE director of undergraduate studies, congratulates the 2022 MSE Junior Award winners (from top) Sophia Chen, Daniel Bilezikian, and Polina Ermoshkina.

Daniel Bilezikian ’23
MSE Undergraduate Research Award

Awarded to one junior student each year who has exhibited both an excellence in academics and also a dedication to materials research through active participation in faculty sponsored research projects, leadership in project teams, and other activities. These students exemplify the scholarly excellence that will enable them to become pathfinders in the future in the materials industry, academia, or other career choices.

Funding support for the $500 prize is provided by the Electronic Packaging Fund donated to the department by Donald Seraphim (IBM), Ronald C. Lasky (IBM), and Che-Yu Li (Cornell professor, using proceeds from their book, “Principles of Electronic Packaging”).

Polina Ermoshkina ’23
MSE Undergraduate Leadership Award

Awarded to a junior based on their achievements as demonstrated holistically by academics, research, service, and community engagement including innovative development of outreach and service to the community through department related activities. Success is often fostered by non-academic skills as much as technical excellence and this award is to recognize students who push the boundaries of an engineering education.

Funding support for the $500 prize is provided by the Electronic Packaging Fund.

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